The main causes of bubbles during the vulcanization of rubber products include material problems, gas entrapment, unreasonable mold design, inappropriate vulcanization parameters, formula defects, and poor rubber-metal adhesion. Solutions require a comprehensive approach encompassing raw material handling, process optimization, mold improvement, and formula adjustment.
Rubber materials become damp during mixing, storage, or use, or moisture is not removed due to weather changes. During mixing, the moisture evaporates, forming bubbles. Batch differences in raw materials can also cause problems.
Air is trapped inside the rubber compound during mixing. If the mold lacks venting channels or the venting process is incomplete, the gas cannot escape, forming bubbles or pores during vulcanization.
Improperly designed or blocked venting holes in the mold prevent gas from escaping during rubber compound flushing; complex mold structure leads to gas accumulation in dead corners.
Insufficient vulcanization (insufficient time or temperature), insufficient vulcanization pressure, excessive impurities in the vulcanizing agent, etc., leading to gas residue or premature decomposition.
Unreasonable material matching in the formula, lack of venting aids; improper use of reclaimed rubber or rubber powder leading to poor dispersibility.
Poor bonding between rubber and metal causes residual gas to shrink under pressure and diffuse to form bubbles after pressure is released.
Summary: Addressing vulcanization bubbles in rubber products requires a systematic analysis of the causes, with coordinated improvements across multiple aspects including raw materials, processes, molds, and formulations. For example, for thick products, extending vulcanization time and optimizing mold venting can help; for damp materials, adding desiccant and changing batches are necessary; and for adhesion issues, improving surface treatment processes is crucial. Through comprehensive measures, bubble formation can be effectively reduced, improving product quality.